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Flip Chip Die Bonding

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Favite offers inlay production service based on Flip Chip Bonding process, which is the highest yield-rate inlay production process.  By dispensing the anisotropic conductive paste (ACP) on the bonding area of RFID antenna, attaching the RFID chip with flip-chip bonding head, heat-curing the ACP up to 10 seconds, the dry inlay products are produced.
Loading Dispensing Head Curing
Wafer Holder Bonding Head
Full View from unloading side Full View from loading side

 
Type: Roll-to-Roll
Inner diameter of reel: 76.2mm (3”)
Outer diameter of reel: Max 600mm
Reel weight: 125Kg per shaft
Web Width: 381 mm
Min Die Size: 0.3mm x 0.3mm
Wafer: 6”, 8”, 12”
Process: ACP Dispenser-Chip Bonding-Curing
Max Bonding Position Accuracy: 15um
Production Performance: 10,000 UPH

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